ISP3D group, research description
Power Electronic Integration

ISP3D Group federates French public research around the main issue of integration of power systems.

Staff is around 80, plus 120 PhD. Locations of research teams are reported on the map:

• Ampère, Lyon
• CIRIMAT, Toulouse
• G2Elab,Grenoble
• GREEN,Nancy
• IES, Montpellier
• IMS-COFI,Bordeaux
• LAAS,Toulouse
• LAPLACE, Toulouse
• LMP,Tours
• LTN, Arcueil
• SATIE, Cachan

Activities addresses monolithic to hybrid integration, and actions are related to technologies and design techniques. A matrix structures the research actions. These actions cover mainly the following topics but through short-term dedicated programs.

• Adequate and suitable materials, related elaboration processes,
• Piezoelectric material for galvanic isolation
• Packaging technologies
• Heat sink and transfer technologies
• Monolithic integration of driving stage and protections
• Passive device integration technologies
• Monolithic low-power systems
• SiC technologies (vertical and planar)
• Design of SiC high-voltage devices
• Design of SiC high-temperature devices and systems
• System architecture for 3D integration and taking benefit of 3D integration
• Multi-physic design of systems (active and passive)
• Behavioral and compact models of devices and systems
• Electro-thermo-mechanical simulation
• Reliability of devices, surge operations
• Reliability of packages

Program matrix features 2 vertical topics (monolithic and hybrid integration) and 2 transversal topics (technologies and design). However scientific experience is shared among the group and works progresses according to the here-under figure which pictures how knowledge aggregates in the group. Figures are reported on following projects to let the reader appreciate the relations between projects.
Main research programs

• Fiducoht(PREDIT EPO-AUTO)
• Subinter (PREDIT EPO-AUTO)
• 3DPhi (founded by ANR)
• CO-THT (founded by ANR)
• JFET-SB (founded by ANR)
• Functional integration (generic work package)
• Mobidic (founded by ANR)
• Layout optimization (generic work package)
• Low-power integration
• Spark Plasma Sintering

ISP3D program relies on facilities available at various locations (see team location map). Two major technical platforms are commonly shared:

• Semiconductor manufacturing plateform (LAAS, Toulouse),